Examples of 'bonding interface' in a sentence
Meaning of "bonding interface"
bonding interface: Refers to the point at which two materials or substances are joined together
How to use "bonding interface" in a sentence
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bonding interface
Partial solutions to this bonding interface stabilization problem have been proposed.
This energy release leads to a high temperature in the bonding interface.
The bonding interface may include at least two metal portions assembled one against the other.
The intermediate support may be eliminated by inserting a blade at the bonding interface.
The bonding interface is advantageously defect-free.
A part of the layer of getter material may form the bonding interface.
The bonding interface carries reference number 4.
This phenomenon causes the formation of bubbles and weakens the bonding interface.
Depositing an adhesive bonding interface on at least the at least one optical element ;.
This is applicable particularly when several treatments can reinforce the bonding interface.
Reference 224 denotes the bonding interface between the surfaces of assembled structures.
To encourage it to stick to said frame without the need for a bonding interface layer.
According to another embodiment, the bonding interface 800 comprises an adhesive of the polymer type.
Such a treatment makes it possible to reduce the defect density at the bonding interface.
Advantageously, the bonding interface 800 is in the form of an adhesive layer.
See also
The structure may also be subjected to a heat treatment to reinforce its bonding interface.
Third alternative embodiment can give a low energy bonding interface on the target substrate.
Copper oxide residues can be responsible for a part of the defects at the bonding interface.
Abrasive product according to claim 8, wherein the bonding interface is thermostable.
The first substrate and the second substrate are assembled via an adhesive bonding interface.
These induced defects are, for example, blisters on the bonding interface between the two substrates.
After bonding, heat treatment is applied so as to consolidate the bonding interface 5.
In particular, the thickness of the oxide at the bonding interface is typically below 50 nm.
Thereby, the presence of copper oxide layers is observed at the bonding interface.
Reference 27 denotes the bonding interface.
Advantageously, the elimination of the second wafer is achieved by detaching the bonding interface.
In the figures, the receiver substrate 1, donor substrate 2, and bonding interface 3 are shown.
The separation then occurs within that weak layer, in immediate proximity to the bonding interface.
Thus, the alloy zone extends on each side of the bonding interface.
The Silicon layer 22 is separated from the BEOL by the bonding interface 24.
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