Examples of 'bonding pads' in a sentence
Meaning of "bonding pads"
bonding pads - are materials or components used in electronics to establish connections between circuits
How to use "bonding pads" in a sentence
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bonding pads
Grow nanotubes between the bonding pads.
Countersinking also allows the bonding pads to be clear of the antenna with the module.
Device for assembling components having metal bonding pads.
The labels associated with the bonding pads will serve subsequently in defining each transducer.
Copper is one of the metals which is particularly widely used to produce bonding pads.
Embed these bonding pads in a dielectric matrix ;.
Assembling the first and second substrates by soldering the first and second bonding pads.
Define bonding pads on the basis of this stack ;.
Excellent for general bracket bonding or for DB lingual retainers with bonding pads.
Stack comprising multilayer bonding pads and the dielectric ;.
Bonding pads arranged in a rectangular array and embedded in a dielectric ;.
If necessary, a protective casing and bonding pads.
Forming first and second bonding pads on the interconnection stack ;.
These connecting points are for instance bonding pads 4.
Power amplifier modules with bonding pads and related systems, devices, and methods.
See also
Vertical connection “ vias ” are produced in the centre of the catalytic bonding pads.
In these figures, said metal bonding pads have not been shown.
In an embodiment, the integrated circuit has a passivation layer with bonding pads.
Advantageously, these are the faces of the bonding pads that are opposite a growth face.
Grow the carbon nanotubes in the channels, thus producing horizontal connections between the bonding pads.
The geometric shape of the bonding pads is also shown in Figure 6a.
On its front surface, printed circuit board 3 comprises bonding pads 9.
FIG . 5 illustrates a leadframe comprising bonding pads according to an example of the present invention.
In particular, the leadframe may comprise the arrangement of bonding pads as illustrated in Figure 5.
Define the bonding pads by lithography ;.
In Figure 5 a leadframe comprising a plurality of bonding pads 2 is illustrated.
Advantageously, the bonding pads have a rhomboid cross-section.
In FIG . 5 a leadframe comprising a plurality of bonding pads 2 is illustrated.
Fabrication of the bonding pads can be realized, for example, as follows.
On assembly, balls 5 of the chip bear against bonding pads 9 of the printed circuit.
Separated bonding pads ( 2 ) and ( 3 ) are achieved and thus an interdigitated electrode structure results.
The metal used to form these bonding pads 58 is preferably nickel.
The geometric shape of the bonding pads is also shown in FIG . 6 a.
Step 303, applying solder paste on the bonding pads 4 through the openings of the steel mesh ;.
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