Examples of 'chemical mechanical' in a sentence
Meaning of "chemical mechanical"
chemical mechanical: This phrase typically refers to processes or systems that involve both chemical and mechanical aspects. It could relate to fields like engineering or industrial processes that require expertise in both chemical reactions and mechanical actions
How to use "chemical mechanical" in a sentence
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chemical mechanical
A chemical mechanical polishing step then occurs.
Abrasive particles for chemical mechanical polishing.
Two chemical mechanical polishing slurries were evaluated.
Thinning is obtained by chemical mechanical polishing.
Chemical mechanical polishing slurry for metal layers.
Patterning is achieved for example by chemical mechanical polishing.
Chemical mechanical polishing slurry useful for copper substrates.
The excess metal is removed by a step of chemical mechanical etching.
Chemical mechanical polishing process for layers of semiconductor or isolating materials.
Such a roughness value may be obtained by chemical mechanical polishing.
Chemical mechanical polishing.
Planarization is for example achieved by a chemical mechanical polishing step.
Chemical mechanical planarisation.
Localisation can be obtained simply by means of a chemical mechanical polishing step.
Chemical mechanical polish.
See also
Said planarisation is for example carried out by chemical mechanical polishing.
To this end chemical mechanical polishing is undertaken with a levelling chemical.
The excess copper is removed in the end with chemical mechanical polishing.
The chemical mechanical composition of this invention includes at least one catalyst.
There are a number of advantages of this chemical mechanical machining and surface finishing process.
Chemical mechanical polishing process for layers of isolating materials based on silicon derivatives or silicon.
The invention discloses a chemical mechanical machining and surface finishing process.
Chemical mechanical polishing of the second metallic layer with a stop on the hard mask.
This invention relates in general to a system for chemical mechanical polishing of semiconductor wafers.
Chemical mechanical polishing composition having chemical additives and methods for using same.
The planarization layer can be formed by chemical mechanical polishing of the deposited passivation layer.
These different depositions can be followed by a localisation step for example by chemical mechanical polishing.
Glass polishing is a chemical mechanical process that only proceeds in an aqueous environment.
Method for producing a membrane comprising micropassages made from porous material by chemical mechanical polishing.
Chemical mechanical planarization is also known by the acronym CMP.
The method is completed with CMP or chemical mechanical polishing.
Chemical Mechanical Planarization is a process of smoothing surfaces using a combination of chemical and mechanical forces.
For example, planarization is performed by a chemical mechanical polishing step.
Chemical mechanical polishing of copper for MEMS applications.
According to one embodiment, the removal step is performed by chemical mechanical polishing.
Chemical mechanical polishing of copper ; no thermal budget.
The method according to claim 4, wherein the thinning is obtained by a chemical mechanical polishing.
A chemical mechanical polishing slurry composition comprising,.
In summary, the present invention provides a system for the chemical mechanical planarization of semiconductor wafers.
Next, the chemical mechanical polishing slurry is applied to the substrate.
The filling can possibly be followed by a step of Chemical Mechanical Polishing, CMP.
Applying the chemical mechanical polishing slurry to the substrate ; and.
Admixing the compositions of claims 8 or 43 and deionized water to give a chemical mechanical polishing precursor ;.
For this, chemical mechanical polishing is carried out with a flattening slurry.
The method used for this purpose is chemical mechanical planarization ( CMP ), for example.
For this, chemical mechanical polishing is carried out with a flattening chemical product.
Finally, the excess metal is removed by chemical mechanical polishing ( CMP ) to form metal vias.
Chemical mechanical polishing of the second dielectric layer, with a stop on the first dielectric layer.
After this, a step of chemical mechanical polishing ( CMP ) is accomplished.
Chemical mechanical planarisation ( CMP ) can then be completed.
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