Examples of 'chemical-mechanical' in a sentence
Meaning of "chemical-mechanical"
chemical-mechanical (adjective) - Relating to a process or device that combines chemical and mechanical elements or properties
How to use "chemical-mechanical" in a sentence
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chemical-mechanical
In a subsequent step chemical-mechanical polishing takes place.
Chemical-mechanical polishing step may also be carried out.
It is preferably compatible with a step of chemical-mechanical polishing.
Cream for the chemical-mechanical preparation of root canals.
The elimination of excess copper by chemical-mechanical polishing.
A mechanical or chemical-mechanical polishing step could also be used.
This step is preferably executed by chemical-mechanical polishing.
A chemical-mechanical polishing step may then be carried out.
Removing the excess copper by chemical-mechanical polishing.
The chemical-mechanical polishing composition optionally comprises a stabilizer.
The polishing may be performed by chemical-mechanical polishing.
The chemical-mechanical polishing composition optionally comprises an abrasive.
Polishing may be carried out by chemical-mechanical polishing.
The chemical-mechanical polishing composition includes a tungsten etchant.
This planarization is for example performed by chemical-mechanical polishing.
See also
Chemical-mechanical polishing ending elimination with selective etching of silicon on.
Metallization in the etching pattern and chemical-mechanical polishing.
As discussed, chemical-mechanical polishing is intrinsically associated with certain disadvantages.
It consists of carrying out chemical etching and / or chemical-mechanical etching.
The chemical-mechanical polishing composition optionally comprises a per-compound.
According to an embodiment, the planarization is carried out by a chemical-mechanical polishing.
The chemical-mechanical polishing composition includes an inhibitor of tungsten etching.
Inhibitors of tungsten etching have been added to chemical-mechanical polishing compositions.
Chemical-mechanical polishing is effective for decreasing the low-frequency waviness.
This step is followed by a chemical-mechanical polishing of the surface of the circuit.
Polishing means any mechanical thinning, inclusive of grinding or chemical-mechanical polishing.
Performing a chemical-mechanical polishing of the upper portion of the ribs ; and.
The thinning is performed by mechanical machining supplemented with chemical-mechanical polishing.
The invention provides such a chemical-mechanical polishing composition and method.
Chemical-mechanical polishing the second metallic layer stopping on the hard mask.
Contacting a substrate with a polishing pad and a chemical-mechanical polishing composition comprising,.
For example, a chemical-mechanical polishing step is performed after stressing by heat treatment.
Depositing an insulating layer and carrying out a chemical-mechanical polish of this layer ;.
A method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor.
The reveal of the vias conducting elements is then executed by chemical-mechanical polishing.
After this chemical-mechanical cleaning, the substrate is introduced into the coating chamber.
Third step for reducing the surface topology by a chemical-mechanical polishing technique.
Chemical-mechanical polishing the second dielectric layer stopping on the first dielectric layer ;.
The stabilizer can be present in the chemical-mechanical polishing composition in any suitable amount.
The chemical-mechanical polishing composition optionally further comprises one or more other additives.
After annealing, the germanium layer may undergo a chemical-mechanical polishing treatment as described above.
The chemical-mechanical polishing composition is especially useful in the method of the invention described above.
Depositing a second insulating layer and carrying out chemical-mechanical polishing of the second insulating layer ;.
Typically, chemical-mechanical polishing compositions for polishing tungsten-containing substrates comprise compounds capable of etching tungsten.
Said removing comprises performing planarization by chemical-mechanical or mechanical polishing or CMP.
Then a Cu chemical-mechanical polishing process is used to remove the.
The principal industrial application of ceria is for polishing, especially chemical-mechanical planarization CMP.
In a particular embodiment, another chemical-mechanical planarization process may be performed to planarize the circuit device.
Planar layer 60 is advantageously obtained by chemical-mechanical polishing.
Chemical-mechanical planarization of the sacrificial mineral layer ;.