Examples of 'direct bonding' in a sentence
Meaning of "direct bonding"
Direct bonding is a method of joining two materials together without the use of any adhesives or fasteners, resulting in a seamless and strong connection
How to use "direct bonding" in a sentence
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direct bonding
Direct bonding is a technique well known per se.
Nitrogen based low temperature direct bonding.
Direct bonding process using a compressible porous layer.
The two substrates are attached by direct bonding.
Direct bonding on to walls or ceilings.
It is compatible in terms of flatness with direct bonding.
Heat treatment to strengthen the direct bonding can advantageously be effected.
This type of bonding will eventually be replaced by direct bonding.
Method for the treatment and direct bonding of a material layer.
Such direct bonding may be accomplished between two semiconducting substrates.
Such complexing is carried out by direct bonding or vía a carrier such as a liposome.
Direct bonding may also contribute to a good impermeability of the window.
This wafer bonding can be a direct bonding or an indirect bonding vía an adhesive layer.
Direct bonding between the first layer and the second layer.
Covering layer assembled at least indirectly to this mixed layer by direct bonding.
See also
All the direct bonding can be effected on the same equipment.
Layer made from a second material on which direct bonding takes place in step c.
The direct bonding according to step b is also carried out at atmospheric pressure.
The ultrasonic welding of the liner was achieved by direct bonding energy to the materials.
Direct bonding the first material layer against the second material layer.
The surface of the second structure is thereby activated before the direct bonding of step c.
Direct bonding techniques are known and include hydrophilic bonding and hydrophobic bonding techniques.
This thermal budget must not induce any surface deformation incompatible with direct bonding.
Rigid connection by direct bonding of the second element with the first bonding layer.
Typically, this layer is bonded by direct bonding.
Process for direct bonding two elements comprising copper portions and portions of dielectric materials.
The method comprises a step of assembling, including a direct bonding.
Direct bonding between the first and second faces ; and.
However, less than a few tens of angstroms are sufficient to spoil direct bonding.
Direct bonding to another OSTE-polymer with the opposite excess groups.
However, such defects can potentially appear during a hydrophobic direct bonding.
However, the direct bonding of thin tungsten layers constitutes a major technological challenge.
In the example described here, the wafers are assembled using direct bonding.
Contact is made by direct bonding of the first substrate and the second substrate ;.
In the example described here, the assembly is carried out using direct bonding.
Among the different techniques under development, direct bonding of metal thin films is a promising solution.
These findings have led to the development of two-layerstructures optimized for direct bonding.
However, direct bonding of copper and resin layers does not always provide sufficient bonding strength.
The contact method is of the adherent type, also designated direct bonding or molecular bonding.
Direct bonding between bone and A-W glass ceramic granules was seen histologically.
Subsequently, reference will likewise be made to molecular bonding, which is also called direct bonding.
Direct bonding is a well-known process.
These include hybrid flip-chip bonding or epitaxial lift-off and other direct bonding methods.
This fixing may be obtained by direct bonding ( also called molecular bonding ).
The method according to claim 10, wherein the transfer is made by a direct bonding technique.
Indeed, the direct bonding of copper on passivation layer 44 is generally of poor quality.
The upper face of the material 116 is then prepared for direct bonding.
The process of assembly by direct bonding according to claim 1, in which the a polishing comprises,.
The surface of the superficial SiO 2 layer is assembled by direct bonding with said surface 20 ′.
In this case, the direct bonding forms a crystalline “ connection ” between the bonded materials.
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