Examples of 'electromigration' in a sentence
Meaning of "electromigration"
Electromigration is a phenomenon in which atoms in a solid material are transported by the movement of ions under the influence of an electric field
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- the transport of small particles under the influence of an electric charge; the separation of ions of isotopes by this method
How to use "electromigration" in a sentence
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electromigration
Nanogaps are obtained by electromigration of a gold nanowire.
It is also intrinsically less susceptible to electromigration.
Electromigration decreases the reliability of chips integrated circuits ICs.
The secondconfiguration used planar tunnel junctions made by electromigration.
Electromigration is not the only high temperature failure mode.
This process is known as electromigration.
Electromigration is typically characterized through the time of failure of a current carrying device.
These memristors work on the basis of the effect of ion electromigration.
Electromigration and delamination at contacts are also a limitation on the lifetime of electronic devices.
An advantage of copper over aluminium is that it gives a better resistance to electromigration.
Another is electromigration.
Trapped moisture may result in increased leakage currents and electromigration.
Capillary electromigration techniques are a relatively new approach for steroid research.
This artifact is especially common with nanogaps produced by the electromigration method.
Capillary electromigration techniques are known for their high resolution power.
See also
This effect results in a band widening detectable as a tailing in the direction of electromigration.
Attempts to design around the electromigration problem have led to unfavorable consequences.
Extreme miniaturization of electronic gates is causing the effects of phenomena like electromigration.
The typical failure of a solder joint due to electromigration will occur at the cathode side.
Copper is more suitable for high current applications as it is more resistant to electromigration.
Barrier and scattering effects induce high resistivity and electromigration exacerbates interconnect reliability.
The disintegration reduces conductor cross section and increases the probability of failure by electromigration.
Further the presence of the dielectric suppresses electromigration across the surface of the device.
Any wire that has a length below this limit will have a stretched limit for Electromigration.
OBIRCH is useful for detecting electromigration effects resulting in open metal lines.
However, pure aluminium is susceptible to electromigration.
Review on Electromigration.
That is, the film is a solid which acts as a barrier to electromigration.
Also, electromigration does not immediately damage your chip.
Further, it does not solve the problem of electromigration on ground conductors.
Effect of electromigration on the mechanical and thermo-mechanical reliability of solder joints.
For the first time, we make nanogaps by electromigration of monocrystalline nanowires.
Nevertheless, there have been documented cases of product failures due to electromigration.
The first observation of electromigration in thin films was made by I. Blech.
In modern consumer electronic devices, ICs rarely fail due to electromigration effects.
The main one is, electromigration.
A wider wire results in smaller current density and, hence, less likelihood of electromigration.
The liquid flow is directed counter-current to the electromigration of ions inside the ion-exchange material 17.
The reliability of the electrical circuit is then reduced, especially due to electromigration effects.
Figure 1, Electron microscope scan of failure caused by electromigration in copper interconnect.
This is due to Cu 's lower resistivity and greater resistance to electromigration.
The resulting high DC current density may lead to undesirable electromigration in the transmission line 26.
This became known as Sudden Northwood Death Syndrome ( SNDS ), which is caused by electromigration.
Also, such Al-Si film is excellent in electromigration resistance.
By contrast, the negative influence is very significant in the case of the electromigration processes.
The literature part introduces rarely used coating materials, block copolymers, in capillary electromigration techniques.
Research shows that adding 2-4 % of copper to aluminium increases resistance to electromigration about 50 times.
Figs . 12 and 13 are box-whisker plots of surface insulation resistance and electromigration resistance.
