Examples of 'flip chip' in a sentence
Meaning of "flip chip"
flip chip: In the context of electronics, a flip chip refers to a type of packaging technology where the active area of the semiconductor chip is flipped facing downwards and directly connected to the substrate or circuit board. This method allows for better electrical performance and thermal efficiency in electronic components
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- A method for interconnecting semiconductor devices to external circuitry with solder bumps that have been deposited onto the chip pads.
How to use "flip chip" in a sentence
Basic
Advanced
flip chip
This type of assembly is achieved using flip chip technology.
Flip chip package.
The device is manufactured using the flip chip technique.
Flip chip machine.
Tools for different flip chip sizes could be changed automatically.
Flip chip assembly.
She has also been identified as a pioneer in early flip chip technology.
We have described a flip chip technique to make continuous beads with vents.
This is one of the basic functions of flip chip bonding equipment.
Flip chip technology poses technical and industrial problems that are hard to solve.
Several methods may be used to attach a flip chip or die to a substrate.
These two entities will allow the study of the report by flip chip.
The flip chip also includes a package with a second inductor of the second oscillator.
Standard conductive epoxy may also be used for flip chip bonding.
The IC is a flip chip and is mounted and soldered onto the lead frame.
See also
The disclosed horn may be used for various flip chip sizes.
Flip Chip bumping by electrochemical deposition.
This complete cycle can nevertheless be started in the flip chip bonding oven.
Flip chip assembly with improved HF-performance.
The integrated circuits also employ a flip chip design for mounting to the wafers.
Flip chip joining is a major sub-set within the área of solder interconnection.
Fixing the optical device to the solder beads using the flip chip technique.
Abstract, Flip chip interconnection technology is a good candidate for high packaging demand.
All these elements lead to increase the production cost of the flip chip technology.
A process for bonding a flip chip to a substrate, comprising,.
The present invention provides an improved process and apparatus for bonding a flip chip to a substrate.
Cree LEDs, flip chip technology, single units damage will not affect others ' normal work.
Coating the monolithic microwave integrated circuit flip chip with the conformal hermetic coating.
The assembly of the IC is performed in a high quality process, such as flip chip.
An apparatus for ultrasonically bonding a flip chip to a substrate, comprising,.
Flip Chip by soldering is done using meltable micro-bossings ( also called balls ).
Reliability of the connection in Flip Chip technology.
Accordingly, the flip chip is not disposed directly under the contact pad 260.
Mechanical characterization of underfill for flip chip - assembly's reliability analysis.
This photoreceptor circuit is mounted on a first portion 10 a of flexible substrate 10 by a flip chip technique.
Looking for hearts to play House Flip Chip and Jo with no limits?
Other device geometries may be used ; the invention is not limited to flip chip ledes.
Prior art Fig . 1 illustrates a conventional led 10 flip chip mounted on a portion of a submount wafer 22.
The package structure is divided into two types, micro-jet structure and flip chip structure.
After dispensing of an underfill encapsulant, the flip chip device is thus constructed.
JUNIORMINT - Digital core packaged into a printed circuit board ( PCB ) and a flip chip.
Locating the monolithic microwave integrated circuit flip chip in said groove ; and, thereafter.
A cloth or paper based card may be provided to house the flip chip IC 28.
Teamwork: The key to success in flip chip design.
Fig 2 shows the use of MEM switches connecting matching networks to flip chip power cells.
Figure 1b illustrates a similar transponder but manufactured according to a flip chip connection process.
The curing cycle is then started, using the above-mentioned flip chip bonding oven.
This eliminates the need to place, retract, and engage the flip chip with the horn.
A pad can, for instance, be used as a flip chip pad.
