Examples of 'flip-chip' in a sentence
Meaning of "flip-chip"
Flip-chip - a technique used in electronics design and manufacturing where a semiconductor chip is flipped and mounted face down onto a substrate, allowing for compact and efficient circuit layouts
How to use "flip-chip" in a sentence
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flip-chip
This transfer procedure is called flip-chip.
The flip-chip is oriented at an angle relative to the substrate.
This transfer can be made by a flip-chip type method or by soldering.
Flip-chip hybridization of microelectronic components by local heating of connecting elements.
These are then interconnected by either wire bond or flip-chip technology.
However, assemblies made by flip-chip bonding are quite susceptible to thermal stresses.
These two parts may be produced with so called flip-chip technology.
The flip-chip technique is one of the techniques used to make electrical connections.
Preferably, this connection is obtained by a flip-chip type assembly such as previously described.
Flip-chip hybridization of microelectronic components using suspended fusible resistive connection elements.
Suitable silk-screened or electroplated flip-chip solder bump techniques may likewise be used.
Flip-chip bonding is an improvement over both wire bonding and tab bonding.
The coefficients of thermal expansion of the flip-chip and the substrate are generally different.
However, the flip-chip bonding process is a considerable advancement over wire bonding.
The integrated circuit may be connected to the self-induction coil antenna by flip-chip.
See also
Thus, flip-chip arrangement is known for monolithic microwave integrated circuits in radar technology.
Aspects disclosed in the detailed description include a flip-chip employing an integrated cavity filter.
These include hybrid flip-chip bonding or epitaxial lift-off and other direct bonding methods.
This invention concerns a card element with integrated circuit mounted using the flip-chip technique.
They may also be fixed by the flip-chip bonding technique as the IC chip.
The dams help contain the flow of an underfill material from a gap beneath the flip-chip.
These Flip-Chip packages do not exhibit any thickening as indicated for certain BGA packages.
Two dams are formed on the PCB around the four walls of the flip-chip.
Miniature power supply, Infineon starts first flip-chip production specifically designed for automotive applications.
The MMIC transceiver chip is mounted on a first surface of the substrate in a flip-chip arrangement.
Use of flip-chip Mixer / Multiplier diodes in packages that were once unattainable.
Fully automated flip-chip assembly.
Flip-chip pin grid array.
This is known as flip-chip bonding.
Flip-chip packaging for millimeter-wave integrated circuits.
The steps of a typical flip-chip bonding process include,.
Flip-chip ultrasonic bonder.
The mounting can be performed, for example, using a flip-chip mounting method.
The flip-chip is pre-coated with a first portion of an encapsulation material.
In addition, very fine resolution can be achieved with the flip-chip bonder.
Flip-chip employing integrated cavity filter, and related components, systems, and methods.
Metallizations 22 are preferably independently connected to a ground plane, for example by a flip-chip type assembly.
Alternatively, the chip may be mounted as flip-chip ( turned over ) and without protective coating.
However, flip-chip bonding does suffer from both mechanical and thermal variations in the solder bumps 6.
In another aspect, a method of forming a flip-chip IC is disclosed.
Flip-chip bondingă»Substrate bonding.
FIG . 1 is a scanning electron microscope image showing the indium chips for the flip-chip.
Flip-chip bonder line.
The soldering is a flip-chip soldering using low-height solder balls 36.
The flip-chip joint can be eutectic, high-lead, lead-free solder or gold stub.
The invention relates to a flip-chip assembly process for connecting two microelectronic components ( 1, 2 ) to each other.
