Examples of 'integrated circuit chips' in a sentence
Meaning of "integrated circuit chips"
integrated circuit chips: Refers to small electronic devices that contain a complex network of interconnected components, such as transistors and resistors, on a single semiconductor chip. These chips are essential for the functioning of modern electronic devices, including computers, smartphones, and digital cameras
How to use "integrated circuit chips" in a sentence
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integrated circuit chips
Electronic memory integrated circuit chips.
This results in an increase in the electrical current used by these integrated circuit chips.
Furnace to solder integrated circuit chips.
This disclosure relates to the field of electronic devices which include integrated circuit chips.
Casing for integrated circuit chips and method of fabrication.
Probe card for testing integrated circuit chips.
Until now, integrated circuit chips have been soldered only in their packages.
The invention concerns a furnace to solder integrated circuit chips.
Method for the testing of integrated circuit chips and corresponding integrated circuit device.
These memories may reside in one or more integrated circuit chips.
Conventionally, the protected integrated circuit chips are capable of detecting a hacking attempt within a critical section.
These memories can reside in one or more integrated circuit chips.
Smart cards, the integrated circuit chips to store and process data is much like a computer.
This highly improves the mounting of integrated circuit chips in casings.
As a result, these integrated circuit chips generate more ohmic heat than the predecessor chips.
See also
integrated circuit card
integrated circuit chip
integrated circuit design
integrated circuit topographies
integrated circuit chip
integrated circuit design
integrated circuit topographies
There are two main types of manufacturing processes for integrated circuit chips.
Semiconductor manufacturers who make integrated circuit chips begin by manufacturing semiconductor wafers.
The methods as described above are used in the fabrication of integrated circuit chips.
The exposed segments could connect to integrated circuit chips through tape automated bonding.
The method as described above may be used in the fabrication of integrated circuit chips.
According to an embodiment, the auxiliary integrated circuit chips comprise electronic components.
Their major limitation is that spring connectors can not accept integrated circuit chips.
An apparatus for testing integrated circuit chips on a wafer, comprising,.
Method and network for improving transmission of data signals between integrated circuit chips.
Electroplated solder bumps are typically used in integrated circuit chips requiring a large number of connections.
The processing circuit may also be realized by various processors or other integrated circuit chips.
Auxiliary integrated circuit chips 18 and 20 may also comprise additional protection devices.
The elements of each CPU subsystem can be constructed from standard integrated circuit chips.
However, integrated circuit chips 18 and 20 do not contain confidential data.
The electronic components 2 of this wafer 1 are for example integrated circuit chips.
Auxiliary integrated circuit chips 18 and 20 are located on each side of main integrated circuit chip 2.
Further, this mechanical fragility is reflected in the implemented integrated circuit chips.
In particular, the components of the different integrated circuit chips are not described in detail.
It specifies the electrical-level details for interoperability between inputs and outputs on integrated circuit chips.
FIG . 1 shows a conventional installation for testing integrated circuit chips on wafers.
These features are made possible by three unique, large-scale integrated circuit chips.
However, the scrambling conditions are the same for all integrated circuit chips.
Under some circumstances, such high currents can damage sensitive integrated circuit chips.
As explained previously, wafer P ′ comprises valid and defective integrated circuit chips IC and DIC.
The board contains a pair of microphones, several resistors, capacitors, and digital integrated circuit chips.
The CMOS drivers 66, 68 can be embodied in one or more integrated circuit chips.
FIG . 1, above described, shows a conventional installation for testing integrated circuit chips on wafers ;.
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