Examples of 'leadframe' in a sentence
Meaning of "leadframe"
leadframe (noun): A structure used in electronics manufacturing to hold electronic components in place and provide electrical connections
How to use "leadframe" in a sentence
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leadframe
The use of a moulded leadframe is also known.
Leadframe processing for molded package arrangements.
Specification for intergrated circuit leadframe materials.
Leadframe materials used in the production.
Wuxi huajing leadframe co ltd.
Leadframe for a semiconductor device and associated method.
Semiconductor package with recessed leadframe and a recessed leadframe.
Stretched leadframe architecture with overmolded spreading lens.
The device comprises a leadframe.
A leadframe is employed with signal conductors and ground conductors.
Method for encapsulating an optocompnent using a leadframe adapted therefore.
Each leadframe includes an anode pad and a cathode pad.
Thank you to identify yourself via the leadframe below against.
Such a leadframe allows for very efficient processing by standard semiconductor technology.
The plastic layer hinders the formation of electrical connections to the leadframe.
See also
Known leadframe structures are not capable for accommodating such high frequency signals.
Unit consisting of two junction field effect transistors contained in a dual leadframe housing.
The leadframe assembly is then stretched so the interconnects unfold to distribute the LEDs spatially.
Other types of optical elements may be used with the ledes on a leadframe assembly.
For ease of illustration, the first leadframe unit will be discussed in detail.
Unit consisting of two metal oxide semiconductor field effect transistors contained in a dual leadframe housing.
Next, the manufacturing process of the leadframe will be explained in turn.
The assembly is attached to a substrate, which may be a leadframe.
Inserting the stretched leadframe assembly and the reflectors into a transparent tube ; and.
After encapsulation, excess portions of the leadframe are trimmed away.
In particular, the leadframe may comprise the arrangement of bonding pads as illustrated in Figure 5.
The method of claim 1, further comprising fixing the stretched leadframe assembly relative to reflectors.
FIG . 5 illustrates a leadframe comprising bonding pads according to an example of the present invention.
For example, sensing elements are usually wire bonded to a leadframe position within the electrical device.
The copper alloy of any one of claims 1 to 10 formed into a leadframe.
Fig . 4 is a plan view of a leadframe assembly in the oximetry measuring means ;.
Fig . 6 is a view of a connector on the sensor leadframe assembly ;.
Leadframe assembly 202 is in a folded configuration typically used early in the manufacturing process.
Fig . 5 is an expanded view of a portion of the leadframe assembly containing the ledes ;.
Hereafter, the encapsulated component can be rid of non-desired parts of the leadframe 51.
Then, each bonding pad of the leadframe is “ detached ” and joined / attached to the cooling substrate.
The term segment refers to any typical straight member of leadframe assembly 202.
In Figure 5 a leadframe comprising a plurality of bonding pads 2 is illustrated.
Hereafter, the encapsulated component can be released from non-desired parts of the leadframe 51.
In FIG . 5 a leadframe comprising a plurality of bonding pads 2 is illustrated.
FIG . 5 illustrates, partially, another variant of a leadframe of a device according to the invention.
Leadframe assembly 1402 has three groups of linearly arranged leadframes.
A method for processing a leadframe ( 18 ) for use with a molded package is disclosed.
Leadframe terminations 54 reside at the bottom of second cavity 54 and can be submerged in a sealant 56.
These legs are slid into the first end 88 of corresponding sleeves 56 of the leadframe 5.
The above-discussed leadframe of Figure 8 has two distinctive features.
The rear face 3 a of the platform 3 also lies in the rear plane 2 a of the leadframe 2.
The leadframe includes a plurality of leads 64a-h having a plurality of corresponding connection points 68a-h.
The bonding energy provided by bonding tool 40 dissipates through leadframe 20 raising the temperature of leadframe 20.
The elevated temperature of leadframe 20 assists in forming a reliable electrical connection between wirebonds 30 and leadframe 20.
