Examples of 'metallization layer' in a sentence
Meaning of "metallization layer"
metallization layer - This phrase is used in the context of materials science or engineering. It refers to a thin layer of metal applied or deposited onto a substrate, often for purposes of conductivity, protection, or aesthetics
How to use "metallization layer" in a sentence
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metallization layer
The second metallization layer consists mainly of niobium.
The control lines will be made on a second metallization layer.
Depositing a metallization layer on top of said contact layer.
Silicon is difficult to wet with solder and requires a metallization layer.
The first metallization layer consists mainly of titanium.
With a cross hatch knife a grid is cut through the metallization layer.
Nor does it damage the metallization layer once it has been applied.
A metallization layer can help prevent gas leakage into the cartridge.
The shielding band is formed from a metallization layer deposited on the substrate.
Second metallization layer is then deposited on the first metallization layer.
The conductive tracks can be produced by technologies other than the etching of a metallization layer.
The metallization layer can further be plated with a nickel layer.
The sandblasting is carried out on the surface intended to receive the first metallization layer.
The metallization layer will be tightly joint with the ceramic body.
The barrier layer 7 can further be a metallic or a metallization layer.
See also
A metallization layer consists of multiple conductor lines surrounded by areas produced in dielectric material.
A document as in claim 1, wherein the underlying metallization layer is patterned.
The first metallization layer permits the attachment of the second metallization layer.
In practice, the bit lines will be made on a first metallization layer.
A metallization layer is deposited on the data surface 3b.
The cross-section of these layers is identical in each metallization layer.
The thickness of the first metallization layer is in the range from approximately 4 to 8 um.
Preferably, at least one connection pad comprises a gold metallization layer.
The thickness of the second metallization layer is in the range from approximately 4 to 8 um.
To increase the reflectivity of the data of layer 7 a metallization layer 9 is deposited.
The metallization layer is still intact and therefore reaches a lifetime of 50 years.
As a variant, each coil has only one turn per metallization layer.
The metals of the metallization layer 51 and of the electrolytic deposit may be different.
According to a modification, the device adjoins a metallization layer of the input to be protected.
Electrically conducting metallization layer 15 is capable of transferring these electrical signals to an analysis circuit.
A diode according to claim 1, wherein the protective layer comprises a metallization layer.
The metallization layer preferably comprises aluminum and can be deposited by a vacuum-deposition process.
To form the turns of these coils, each coil describes a spiral in a metallization layer.
In the experimental part, elements with varying contact metallization layer thicknesses were evaporated and annealed.
In prior-art sensors, the measurement and excitation coils are each made on a single metallization layer.
The said layer is covered with a tin-lead metallization layer which services as a soldering link element.
This maximizes the shielding properties of the second metallization layer M2.
This second metallization layer constitutes firstly the transmitter coil 10.
The integrated circuit according to claim 1, wherein the one metallization layer is an interconnect level.
A metallization layer 46 is deposited onto the surface of the dielectric 42, typically by a conventional evaporation process.
The integrated circuit according to claim 1, wherein the one metallization layer is a gate level.
The metallization layer may be either a continuous one 21 or appear as separate electrically insulated portions 22.
Here, these conductive tracks are distributed between an upper metallization layer and a lower metallization layer.
The metallization layer typically comprises a layer of 25 microns of copper covered with 5 microns of tin-lead.
Its lower face advantageously receives a metallization layer 66.
Standard p metallization layer 21, for example a layer of AuPt, is deposited.
A metal other than aluminium can also be used to produce the metallization layer 112.
An n metallization layer 20, for example a layer of TiAu, is then deposited.
Lower electrical track 208 produced by etching a lower metallization layer of the printed circuit.
Under the first metallization layer is a layer of beryllia ( BeO ) 16.
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Examples of using Metallization
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