Examples of 'molding compound' in a sentence
Meaning of "molding compound"
molding compound: A molding compound refers to a material that can be shaped and molded into specific forms or shapes, commonly used in manufacturing and construction industries
How to use "molding compound" in a sentence
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molding compound
Method for making a discontinuous fiber molding compound.
Epoxy molding compound.
The drying step also preheats the molding compound.
The sheet molding compound was then allowed to mature to molding viscosity.
Put it in the molding compound.
This plug can be secured in the housing by the injection molding compound.
A pelletized form of the molding compound is generally required for injection molding.
A seal of this type is relatively sensitive when injection molding compound is applied to it.
The molding compound should be dried under any suitable conditions to remove excess moisture.
In a preferred embodiment the encapsulation material is formed of a fiber filled molding compound.
The penetration of the injection molding compound into the gap is thus reliably prevented.
In one preferred embodiment of the present invention the plastic is a thermoplastic molding compound.
A molding compound comprising a composition of matter as defined by claim 1.
A process for forming a composite structure of thermoplastic polymer and sheet molding compound.
Preferably, a flexible molding compound is applied.
See also
Molding techniques result in a cable having multiple conductors surrounded by some sort of molding compound.
Heating a thermosetting epoxy molding compound to a liquid state, and.
The present invention relates to a thermosetting resin composition and a thermosetting resin molding compound.
A method for producing a sheet molding compound comprising the steps of,.
Preferably, the circuit board is overmolded by a molding compound.
In injection molding process, molding compound is fed into an extruder vÃa a hopper.
Preferably, the separating element is fused to the injection molding compound.
The epoxy molding compound according to claim 1, wherein said hardener is an anhydride.
SMC stands for sheet molding compound.
The molding compound of claim 9 wherein the reinforcing fibers are glass fibers.
In general, virtually any thermoplastic molding compound may be used.
The epoxy molding compound according to claim 1, wherein said hardener is a phenolic novolac.
Additionally, pigments may be added to impart color to the molding compound.
A resinous composition for a sheet molding compound comprising the reaction product of,.
The ultraviolet-absorbing, preferably transparent layer is based on a thermoplastic molding compound.
Quasi-isotropic sheet molding compound has been widely used to make composite tooling.
The molded cable as set forth in claim 2 in which said molding compound is silicone.
The epoxy molding compound of claim 1, wherein said inorganic filler includes silica.
In a preferred embodiment, the polymer present in the molding compound is a thermoplastic polymer.
The sheet molding compound is essentially alcohol free and contains up to 3 weight percent water.
Thermosetting resin composition, thermosetting resin molding compound and cured product thereof.
Preferably, the molding compound substantially consists of the same material as the carrier plate.
In preferred embodiments, bucket 8 is manufactured from material including at least sheet molding compound.
The epoxy molding compound of claim 1, wherein said epoxy molding compound includes a colorant.
Various fillers and additives, as well as colorants may be utilized in the molding compound.
An injection molding compound as defined in claim 5 wherein the reinforcing filaments comprise graphite fibers.
A process for producing a glass fiber-containing molding compound comprising the steps of,.
An injection molding compound as defined in claim 1 wherein the thermoplastic adhesive comprises poly ( ethyl oxazoline ).
The invention further provides a method for producing a sheet molding compound comprising the steps of,.
The bulk molding compound is generally a resin-based compound having short glass fibers impregnated therein.
Encapsulating a semiconductor device with said thermosetting epcxy molding compound heated to a liquid state, and.
The epoxy molding compound of claim 1, wherein said epoxy molding compound includes a silane coupling agent.
Preferably, the separating element is formed from the same material as the injection molding compound.
When introduced into the injection mold, the injection molding compound has a relatively high temperature.
The first tooling section is made from multiple layers of cured quasi-isotropic sheet molding compound.
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