Examples of 'planarization' in a sentence
Meaning of "planarization"
planarization (noun) - the process of making a surface flat or level
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- The act or process of planarizing
How to use "planarization" in a sentence
Basic
Advanced
planarization
Those known planarization techniques are described below.
Delamination is generally indicated by internal planarization of the fibers.
This planarization layer does not need to be transparent.
This topography simplifies the planarization of passivation layers.
This planarization is effected in two steps.
It is followed by a step of planarization of the surface.
The planarization may be accomplished by a variety of planarization techniques.
Preferred backings for semiconductor wafer planarization are very uniform in their thickness.
Planarization schemes make the processing more complex.
Patterning is achieved by a planarization step associated or not with an etching step.
Planarization is for example achieved by a chemical mechanical polishing step.
These problems are in fact directly associated with the effect of deposition planarization.
For example a planarization method could be used.
Materials and spin coating methods suitable for advanced planarization applications.
The planarization layer is completely removed in the dicing paths.
See also
Between the semiconductor wafer and the plate there are only planarization layers.
Such planarization processes are increasingly common and are most effective.
The stop layer may then serve to mark the end of the planarization.
A variety of planarization techniques are in use.
The exemplary embodiment is not intended to limit the implementation of the planarization process.
Planarization is then carried out to remove the excess deposited metal.
These effects are not uniform across the wafer surface during the planarization process.
Planarization so as to leave the material only at the locations of the etching.
Chemical mechanical planarization is also known by the acronym CMP.
Planarization by transformation.
The deposition was followed by a CMP planarization step to obtain a planar layer.
The planarization step inevitably affects the yield of the transfer method.
Field of the Invention This invention relates to a planarization process for integrated circuit structures.
A planarization phenomenon may be generated by a general video encoding and decoding system.
A concern related to multi-layer stacking is planarization.
The planarization of surface topography by spin coating has been the subject of numerous studies.
In one embodiment, this is accomplished using a planarization technique.
Planarization operation is done until the free face of the first protection layer is exposed.
The abrasion step is preferably performed by mechano-chemical planarization.
The planarization layer can be formed by chemical mechanical polishing of the deposited passivation layer.
Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride.
The planarization and / or thermal treatment may be repeated.
A device according to claim 1, wherein the insulating planarization layer is made of polyimide.
Wherein thicknesses of the planarization layers decrease successively in a direction away from the polymer substrate.
Preferably, this adjustment step results from mechano-chemical planarization or polishing.
Chemical Mechanical Planarization is a process of smoothing surfaces using a combination of chemical and mechanical forces.
A transparent conductive layer 5 is coated onto the high index planarization layer 4.
This planarization is for example performed by chemical-mechanical polishing.
The method of claim 1, further comprising a step of planarization of both surfaces of the substrate.
For example, planarization is performed by a chemical mechanical polishing step.
Production of the interconnects is then completed by a conventional step of planarization by mechanical-chemical polishing.
This planarization is for example performed by chem-mech polishing.
This introduces ridges locally and is counter-productive to the desired aim of planarization.
In incremental planarization, the planarization process is split into two stages.
In situ monitoring technique and apparatus for chemical / mechanical planarization endpoint detection.
