Examples of 'plating solution' in a sentence
Meaning of "plating solution"
plating solution: This phrase is commonly associated with electroplating processes, where a thin layer of metal is deposited onto a conductive surface. It refers to the chemical solution used in the plating process to facilitate the deposition of the metal coating
How to use "plating solution" in a sentence
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plating solution
Electroless nickel plating solution and method.
The auxiliary cathode is in electric contact with the plating solution.
The condition of a plating solution is as follows.
The copper substrate was then introduced into the plating solution.
Preferably said electroless plating solution is a gold plating solution.
The preferred coatings are electrodeposited from an acid zinc sulfate plating solution.
Each activated cup was immersed in a plating solution at room temperature.
This copper plating solution is useful for depositing copper on a circuit board substrate.
Plating method by means of an electroless gold plating solution and system therefor.
The current copper plating solution is useful for the manufacture of solar cells.
The durable life of this material in a chemical tin plating solution is limited though.
The dwell time in the plating solution was nine minutes unless specified otherwise.
The articles may also be contained in drums which are dipped into the plating solution.
Electroless nickel plating solution and process for its use.
The Ni is provided in the form of a plating solution.
See also
Preferably said electroless plating solution is introduced into a passage not previously sensitised.
Contacting the surface of the substrate with an electrolytic plating solution comprising,.
The plating solution and coppersulfate solution counterflowed through the dialysis membrane system.
Be sure the tops of the bags remain above the plating solution to avoid roughness.
The electroless plating solution inevitably enters into the pore channels of the chosen substrate.
Suitably the tool comprises means to feed a supply of plating solution to the absorptive member.
However, this plating solution does not contain copper pyrophosphate.
Contacting the substrate with a plating solution comprising,.
The plating solution used had the following formulation,.
An electroless nickel plating solution comprising,.
The plating solution is an organophosphanate base, cyanide-free copper electrolyte.
Said anodes are soluble and / or said plating solution is based on chloride anions.
The conditions were chosen to provide 10 g or carbon black per liter of plating solution.
Plating Process The electroless plating solution may be any known autocatalytic electroless plating solution.
It is desirable that the insulating layer 9 be a material having chemical stability to a plating solution.
The electroless plating solution may be aqueous or non-aqueous.
After a water rinse, the filament is coated with copper in a copper pyrophosphate plating solution.
Preferably, the silver plating solution is an immersion or electroless silver plating solution.
A process according to claim 6 wherein the silver plating solution also comprises an oxidant.
The plating solution composition given above may be varied in the following ranges,.
A process according to claim 5, wherein the plating solution also comprises an antioxidant.
In addition, the imidazole also extends the useful life of the immersion plating solution.
The composition and operation of the plating solution is controlled by digital computer 30.
A vanadium stabilizer system was tested in a solution taken from a working, production electroless copper plating solution.
The pH value of the depositing plating solution should preferably be between 4 and 5.
The plating solution was prepared similar to that of Example 3.
In certain non-limiting embodiments, the plating solution may be held at a constant temperature.
Internally developed products, including the unique Silver Plating Solution.
An electroless gold plating solution as defined in claim 1, which contains alkaline metal cyanide.
Depending on the material that is electroplated, the plating solution can be aqueous or organic.
An electroless copper plating solution was prepared with the following composition, Copper sulfate.
A method according to any preceding claim, wherein the metallic plating solution is a non-homogeneous plating solution.
The plating solution contains,.
Once the plating is complete, the depleted plating solution is removed from the plating vessel.
The plating solution 16 used for acidic copper plating contains copper ions.
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