Examples of 'semiconductor element' in a sentence
Meaning of "semiconductor element"
A semiconductor element refers to a material commonly used in electronic devices, which has electrical conductivity between that of a conductor and an insulator. It is an essential component in the construction of devices such as transistors, diodes, and integrated circuits
How to use "semiconductor element" in a sentence
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semiconductor element
The thermoelectric unit includes a semiconductor element.
The semiconductor element may also be an integrated circuit.
The first substrate comprises a switching semiconductor element.
A semiconductor element capable of switching operation may be used.
Another technique used to manufacture a semiconductor element is evaporation in vacuum.
Semiconductor element drive device.
Piezoelectric semiconductor element.
Semiconductor element module.
The termination comprises a semiconductor element that encircles the electrical cable.
Optical coating deposits can be made on the faces of the semiconductor element.
The switching semiconductor element is provided on the first surface.
Forming a gate electrode on the gate insulator at the vertical of the semiconductor element.
Chip semiconductor element.
Piezoelectric drive or sense means arranged in mechanical contact with the semiconductor element.
Researchers in Germany have managed to make the old semiconductor element germanium into a superconductive material.
See also
A second semiconductor element mounted on said rising portion; and.
Optionally, the second substrate comprises a semiconductor element.
According to an embodiment, each semiconductor element comprises a microwire or a nanowire.
The light source ( s ) can preferably comprise sources with an electroluminescent semiconductor element.
According to an embodiment, each semiconductor element is a microwire or a nanowire.
Accordingly, the damaged led is replaced without changing the whole semiconductor element string.
According to an embodiment, each semiconductor element mainly comprises gallium nitride.
The pickup also acts as an address pointer if the DSM 1 is a semiconductor element.
Therefore, a semiconductor element module having a high reliability can be obtained.
Meanwhile, an acceleration sensor constituted by a semiconductor element is known.
Device according to claim 1, the semiconductor element being the gain medium of a semiconductor laser.
Preferably, the light sources may be light-emitting semiconductor element sources.
Device according to claim 1, the semiconductor element comprising a semiconductor film epitaxied on a substrate.
Preferably, the porous deposits are provided with platinum and the semiconductor element with palladium.
Each three-dimensional semiconductor element is covered with an active layer capable of emitting light.
A method for bonding a metallic element and a semiconductor element comprising,.
The first electrode, the first semiconductor element, the second semiconductor element and the second electrode.
The differential pressure transducer 22 is a semiconductor element.
The first electrode, the first semiconductor element and the second semiconductor element ; or.
The heat may be generated in the switching semiconductor element 144.
Normally, the power semiconductor element has a very small heat capacity and shows a rapid temperature change.
According to one embodiment, the semiconductor element is a plate.
The most used semiconductor element is Silicon, which is a basic material in the electronic industry.
According to one embodiment, the semiconductor element is a beam.
A semiconductor element with n-type doping forms,.
The optoelectronic device of claim 3, wherein each semiconductor element mainly comprises gallium nitride.
The semiconductor element 33 then becomes conductive.
According to an embodiment of the present invention, each semiconductor element mainly comprises gallium nitride.
Figure 2 - Bending of semiconductor element with molybdenum disc after flawless alloying process.
GERMANIUM, Germanium is a semiconductor element.
Figure 3 - Bending of semiconductor element with molybdenum disc after sintering process.
An inversion channel in the semiconductor element 33.
A semiconductor element with p-type doping forms,.
According to an embodiment, each semiconductor element is mainly made of a III-V compound.
A semiconductor element 3 such is joined on the ceramic substrate 1.
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