Examples of 'support substrate' in a sentence
Meaning of "support substrate"
support substrate: refers to a base, foundation, or underlying structure that provides stability, reinforcement, or sustenance for something else. This phrase is often used in technical, scientific, or engineering discussions about materials, systems, or processes
How to use "support substrate" in a sentence
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support substrate
The support substrate serves as mechanical support.
The reed switch resides on a support substrate.
The support substrate is able to be functionalized or not.
An encapsulator is deposited and is bonded to a second support substrate.
The support substrate is a sapphire wafer.
A cap is deposited and is bonded to a second support substrate.
The rigidity of the support substrate depends on the required applications.
This formulation gave good penetration and adhesion to the support substrate.
Wherein the second support substrate is thicker than the second substrate.
Method of producing a semiconductor structure having at least one support substrate and an ultrathin layer.
The final support substrate is of a material that the first patterns include.
The binding of antibodies to a solid support substrate is also well known in the art.
A support substrate that does not have any immobilized receptor is also used as a control.
The electrically insulating material is different from the material forming the support substrate.
The support substrate may have a polyolefin coating on one or both opposing surfaces thereof.
See also
This technology allows a composite structure to be made by transferring a thin layer onto a support substrate.
The integrated circuit comprises a support substrate having opposite first and second main surfaces.
In certain embodiments the acid used for quenching in a form including a solid support substrate.
The support substrate employed can be a conventional substrate such as ceramic and metal honeycomb structure.
A porous loading layer is formed on a surface of a catalyst support substrate which exhibits heat resistance.
Support substrate 1 is advantageously produced from a semiconductor material.
The second route includes full destruction of the alumina or zirconia catalyst support substrate.
Hence the chip support also constitutes a support substrate for the analysis and the addressing electrodes.
The dynamic release matrix is again a thin metal film applied onto a polyester film support substrate.
According to an embodiment, the support substrate is transparent.
The antibody used to bind BVDV Erns protein can be bound to a solid support substrate.
Advantageously, the support substrate is made of silicon or glass.
The electrically insulating area is formed in support substrate 2.
The support substrate 31 is then removed by means of chemical dissolution or etching.
In a preferred embodiment, the support substrate is flexible.
The support substrate comprises first and second counter-electrodes.
In this case, only the support substrate is removed.
According to said document, an led is placed on a support substrate.
This device comprises a support substrate constituted by the receiving matrix 2.
The cavity presents side walls formed by support substrate 1.
Release of a part of support substrate 2 is advantageously achieved by means of anisotropic etching.
Mobile element 6 is thus formed inside the support substrate.
The support substrate 1 essentially provides rigidity to the SeOL structure.
It also comprises a device with a mobile element 5 located in support substrate 1.
The portions of support substrate 1 are also laterally offset from one another.
After cleavage, a thin layer adhering to the support substrate is obtained.
For this reason, support substrate 1 is advantageously formed from a semiconductor material.
Dielectric material layer 3 is also patterned to allow access to support substrate 2.
Advantageously, the material of the support substrate is identical to the shielding layer.
In a preferred embodiment, the length of electrodes 7 is equal to the thickness of support substrate.
Providing a support substrate having a cavity formed on one face thereof, and.
The nanostructure according to claim 2, wherein the base is disposed on a support substrate.
The method as set forth in claim 1, the support substrate being made in a semiconductor material.
The first and second main walls are therefore separated by support substrate 1.
The extent of support substrate 2 that is accessible depends on the etching methods used.
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