Examples of 'surface of substrate' in a sentence
Meaning of "surface of substrate"
surface of substrate - This phrase refers to the top layer or exterior of a material or substance on which another material is placed or with which it interacts
How to use "surface of substrate" in a sentence
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surface of substrate
The surface of substrate may include a plurality of hollows.
This interaction will lead to periodic nanostructuring on the surface of substrate 10.
On the lower surface of substrate 1 is formed a heavily-doped collector contact N-type layer 7.
The top surface of layer 2 is substantially parallel to the surface of substrate 1.
The lower surface of substrate 1 is coated with a metallization M 1.
The jet 4 leaving the pneumatic atomizer is projected directly on the surface of substrate 6.
Photosensitive area 8 only covers a portion of the surface of substrate 7 associated with photosensitive area 6.
The metal layer is preferably nickel-based and deposited on the whole surface of substrate 1.
Insulating pattern 1 extends upwards beyond the surface of substrate 3 and active area 2 which it delineates.
The thus obtained gallium nitride layer 2 adheres strongly onto the surface of substrate 1.
The upper surface of substrate 301 is preferably planar.
The four steps described above are achieved onto the whole surface of substrate 10.
The rear surface of substrate 23 is covered with a metal ground plane 25.
Well 3 is formed from the upper surface of substrate 1.
An inner surface of substrate 62 may contact the exterior of absorbent article 32.
See also
Then, an insulating layer is formed at the surface of substrate 40.
Slots 12 on each surface of substrate 20 may be the same or different in size.
The sample to be analyzed is placed on this surface of substrate 19.
The surface of substrate 32 turned towards substrate 34 carries a first group of electrodes 40.
In a privileged embodiment, a protective layer 7 is formed at the surface of substrate 1.
The rear surface of substrate 60 comprises an overdoped layer 73 coated with a metallization 74.
As a result, a prescribed film can be formed on the surface of substrate 12.
A substrate 12 is fixed on that surface of substrate stage 11 which is opposed to target stage 13.
Dielectric layer 14 need not necessarily cover the entire surface of substrate 9.
This provisional support 8 is initially deposited on the surface of substrate 1 opposite that comprising chips 2.
These insulating strips 17 are uniformly distributed over the entire surface of substrate 12.
An electrically insulating layer 21 partially covering one surface of substrate 20 can also be distinguished.
In a preferred embodiment, an adhesive layer is applied to the entire upper surface of substrate 12.
Also shown is an ohmic contact 51 formed on the surface of substrate 30 opposite epitaxial layer 32.
This capacity 16 comprises a silica layer 18 constituting a dielectric and placed on the surface of substrate 10.
In FIG . 1B, no oxidation of the upper surface of substrate 1 has been shown.
As a result, a film can be formed densely and uniformly on the surface of substrate 12.
Paste 32 may be applied over a major surface of substrate 2.
Figure 2a is a magnified closeup depiction of a small section of the printed surface of substrate ply 202.
Spacer member 410 is subsequently secured to the upper surface of substrate 86 by a layer of adhesive.
Alternatively, prelaminate structure 117 can be laminated on the embossed surface of substrate 12.
A slightly conductive coating ( B ) is deposited over the entire surface of substrate ( C ).
A ground plane 42 is formed simultaneously to line 14 in the surface of substrate 4.
In the shown examples, gates of transistors 12 are formed at the surface of substrate 10.
As in the previous embodiments, a writing material 36 overlays one surface of substrate 34.
Finally, step f includes a phase of removing mould 18 from the surface of substrate 1.
The lower surface of chilling roll 26 contacts the upper surface of substrate 14.
This substrate 12 is covered with a support layer 30 that completely covers the surface of substrate 12.
Device 10 also comprises an electrically insulating layer 21 which partially covers one surface of substrate 20.
A highly doped N-type region, N1, is formed on the lower surface of substrate 1.
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