Examples of 'wire bonding' in a sentence
Meaning of "wire bonding"
wire bonding: A method used in electronics assembly to create a reliable mechanical and electrical connection between two surfaces using a metallic wire. This phrase is commonly used in the context of semiconductor technology and microelectronics.
How to use "wire bonding" in a sentence
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wire bonding
These connections are preferably of the wire bonding type.
The wire bonding industry is transitioning from gold to copper.
This connection is done by wire bonding.
Two wire bonding procedures.
The connections methods may comprise wire bonding operations.
It is a wire bonding technique that can be performed at ambient temperature.
They are connected by wire bonding.
Wire bonding method is one of the most important interconnection techn.
One exemplary technique forms the contacts by wire bonding.
This recognition resulted in the wire bonding technique described above.
Then wire bonding interconnections are formed between substrate and package leads.
The corresponding lines are connected by wire bonding or the like.
Features double wire bonding upgrade to protect against issues caused by vibration.
The actual electric connections are made with wire bonding or similar means.
Therefore, wire bonding can be efficiently performed.
See also
These techniques desirably are used in the wire bonding step of the present method.
This image clearly shows the entire section where the pads are soldered during wire bonding.
This centerto center spacing is adequate for wire bonding or tape automated bonding.
The interconnections between the LED chips and the Zener diodes are made by wire bonding.
This center to center spacing is adequate for wire bonding or tape automated bonding.
Wire bonding simply refers to connections made by small, thin wires.
The lead wires may be attached by known wire bonding techniques to a conductive chip pad.
Electrolytic soft gold is plated on features that require bondable gold for wire bonding application.
The steps of a typical wire bonding process include,.
The chip is upside-down with respect to wire bonding.
The labor-intensive wire bonding process is therefore replaced by a standard soldering process.
A second contact layer material may be required to facilitate wire bonding to the platinum films.
Wire bonding of the regulating element and the filtering circuit, during a third step ;.
A PCB or another lead frame uses a gold wire or copper wire bonding interconnection manner.
Wire bonding method with a frame, for connecting an electronic component for testing and mounting.
PCBs for gold wire bonding.
Of course, as a variation, the microcircuit can also be mounted by wire bonding.
At the same time, fault-free wire bonding to the silver surfaces must be possible.
The electrical connection of the component 2 may for example use wire bonding.
It should be noted that wire bonding includes ball bonding, wedge bonding, and the like.
Flip-chip bonding is an improvement over both wire bonding and tab bonding.
Automatic wire bonding machine 2.
However, the flip-chip bonding process is a considerable advancement over wire bonding.
This component is connected by wire bonding ( not represented ) to a trace circuit 6.
For example, the electrical connections can be formed with well-known wire bonding techniques.
The wire bonding may be performed with a gold, silver, copper, or aluminum wire.
These contacts can be made by two main technologies, wire bonding and tab bonding.
The formed wire bonding capillary 45 is coated or plated with an electrically conductive coating 46.
FIG . 3 depicts the installation of soldered wires according to the wire bonding technique.
Wire bonding can be used at frequencies above 100 GHz.
The LED chips are interconnected in a series-parallel array with the interconnections made by wire bonding.
Capable of Gold and Copper wire bonding ( Option ).
Terminals 444 are connected to any external equipments through the wire bonding.
Previous methods also required bonding such as thermosonic ; lasersonic ; soldering ; or wire bonding.
The electrical connections between the substrate 20 and the chip 18 are produced by wire bonding.
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