Examples of 'deposition processes' in a sentence

Meaning of "deposition processes"

deposition processes: The methods or actions involved in depositing a substance onto a surface

How to use "deposition processes" in a sentence

Basic
Advanced
deposition processes
These deposition processes are examples of granular convection.
Improvements in physical vapour deposition processes.
Most deposition processes are at least somewhat directional.
It is exploited in the manufacturing of optical fiber in vacuum deposition processes.
Some deposition processes have been listed.
Vacuum line chemistry in selected atomic layer deposition processes.
The deposition processes of the present invention are environmentally friendly.
Develop accuracte models to simulate the different deposition processes.
Combinations of these deposition processes may be used to construct a multilayer.
Another drawback is the high cost of these deposition processes.
The deposition processes were performed by aspersion of alcoholic dispersions and electrospinning.
This table highlights two different categories of deposition processes.
It is preferable to use deposition processes which allow even higher speeds.
They can also be the result of erosion or soil deposition processes.
The other deposition processes also suffer from a certain number of disadvantages.

See also

Lower quality materials that use cheaper deposition processes are being researched as well.
Firstly the insulants were deposited by conventional chemical vapour phase deposition processes.
These infiltration and deposition processes are well known to a person skilled in the art.
These thin film stresses result from the particulars of a deposition processes.
Chemical vapor deposition processes are well known in the art of coating glass substrates.
The present invention is applicable to all types of internal vapour deposition processes.
A particularly preferred group of deposition processes comprises cathodic arc physical vapor deposition.
The photovoltaic cells are fabricated directly on the upper plateau by vacuum deposition processes.
These deposition processes are typically carried out at high temperatures and for extended times.
The present invention may also be utilized in other types of plasma deposition processes.
Each of these chemical vapor deposition processes is carried out in a high temperature reaction chamber.
Models of precipitation scavenging of contaminants from air have advanced our understanding of deposition processes.
Common methods for monitoring plasma etch and deposition processes include spectroscopy and interferometry.
Pulsed deposition can be used for the same reasons as in prior art deposition processes.
Alternatively other CVD deposition processes can be used.
These electrodes may for example be flattened against the membrane by thin layer deposition processes.
However, vacuum deposition processes are preferred.
The other materials proposed for making the tip can be deposited by conventional deposition processes.
Moreover, electrolytic deposition processes are widely used on an industrial scale.
These methods are substrate size limited and more expensive than chemical vapor deposition processes.
Moreover, other known deposition processes may also be used.
The second aim consists in correlating the films structure and properties with the deposition processes.
Slurry-based coating deposition processes may also be utilized.
Thin films of nanocrystalline materials can be produced using vapor deposition processes such as MOCVD.
However, pyrolytic deposition processes are not very flexible in production.
This technique has application to wafer cleaning, etching and deposition processes.
Moreover, physical vapor deposition processes are susceptible to pin holes.
In one method, the reflective layer is applied to the elements 112 by vapor deposition processes.
Non-limiting examples of deposition processes are adsorption and mixing.
Moreover, deposition processes for such colloidal coatings have also been described.
All physical vapor deposition processes consist of the following steps,.
Metal deposition processes may use either alternating current or direct current, or a combination thereof.
Generally, wet deposition processes remove particles from the atmosphere.
The deposition processes can be varied ( LPCVD, CVD, epitaxy, and the like ).
In general, microwave deposition processes take place at pressure ranges of approximately 1 millitorr to 1 torr.

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