Examples of 'sputtering process' in a sentence
Meaning of "sputtering process"
sputtering process: This term refers to a physical vapor deposition technique used in manufacturing and materials science to deposit thin films of material onto a substrate. It involves the ejection of atoms from a target material due to bombardment with energetic particles
How to use "sputtering process" in a sentence
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sputtering process
An original sputtering process for surface coating.
The technique used may be a glass sputtering process.
The sputtering process may be a better solution.
It serves as an anode in the sputtering process.
An original sputtering process for surfacecoating.
Adhesion was found to be controllable via sputtering process parameters.
This reactive sputtering process is well known and used commercially.
Thin films have been realized using magnetron sputtering process.
The deposition is effected by a sputtering process in the presence of nitrogen gas.
Metals and dielectrics targets are used in the sputtering process.
Ion etching is a sputtering process that can remove very fine quantities of material.
The tantalum nitride film is produced by a reactive sputtering process.
This shows that the sputtering process leads to metal film deposits with undesirable morphological characteristics.
This measure simplifies substantially the control of the sputtering process.
The magnetron sputtering process was study by Langmuir probe measurement and Optical Emission Spectroscopy.
See also
Nevertheless they can cause particle generation during a sputtering process.
An original sputtering process for surfaee - eoating.
These are applied to the backside of the displays using the magnetron sputtering process.
The above layers can be formed by a sputtering process in an Ar gas atmosphere.
This thesis tested the production of metallic nanoparticles deposited on powder substrates by sputtering process.
For example, the sputtering process may be used.
Stray magnetic fields leaking from ferromagnetic targets also disturb the sputtering process.
Additionally, sputtering process can be performed in continuous or batch applications.
For the coating process either the arc technique or the sputtering process can be considered.
Further, the sputtering process can be accomplished at a much lower gas pressure.
This process generally requires high vacuum or at least low vacuum during the sputtering process.
The sputtering process is the most important technique for material deposition in CIGS-manufacturing.
The sputtering is carried out by the DC plane sputtering process.
The sputtering process was performed at room temperature in a pure argon ( Ar ) atmosphere.
The biocide layer is applied in a DC magnetron sputtering process using a copper target.
This particular sputtering process is also referred to herein as " ion beam deposition . ".
This deposition is, in particular, carried out by a conventional sputtering process.
Figure 1 shows one example of a prior art sputtering process and the equipment used therein.
The translucent conductive films 4 and 8 are formed by a magnetron sputtering process.
For Example 1, the following sputtering process parameters were used in depositing the coating.
Alternatively, a metal deposition process such as a thin film sputtering process may be used.
Ion etching = = = Ion etching is a sputtering process that can remove very fine quantities of material.
Depositing an infrared reflective metal layer on a substrate by a non-reactive sputtering process and.
Figure 1B is a schematic drawing of the sputtering process using the apparatus of Figure 1A.
Additionally, coated glass articles are produced " off-line " through a sputtering process.
Details concerning said sputtering process are described, for example, by J. I.
Preferably, the metal layer 5 is applied using a sputtering process.
The DC sputtering process was operated with the generator AE-Pinacle+20 kW.
To get a uniform coating on a large área, a sputtering process is preferred.
The deposition of layer 62 and also layer 64 can be carried out by a magnetron sputtering process.
FIG . 3 is a diagram representing the conventional ( RF ) sputtering process and the various elements involved.
A cylinder 59 includes formed as its outside surface 61 the target material desired for a particular sputtering process.
The light absorption layer 310 may be formed using a sputtering process or an evaporation method.
Alternatively or in addition thereto, the substrate 22 can be heated during the sputtering process itself.
The metal oxide layer 50 is formed by the same sputtering process using ITO.
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