Examples of 'thermal budget' in a sentence

Meaning of "thermal budget"

Thermal budget: Refers to the allocated or available resources for managing heat generation, dissipation, or transfer within a system or process. This term is commonly used in engineering, thermal design, and energy management applications

How to use "thermal budget" in a sentence

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thermal budget
The maximum allowable thermal budget is imposed by the structure itself.
Thus it is the most important base for the thermal budget.
The thermal budget applied also results in diffusion of the latter into the semiconductor.
One solution consisted in implementing an approach with a lower thermal budget.
Solutions have enabled this thermal budget to be increased to increase the dopant activation ratio.
This shows the dominating influence of radiation upon the thermal budget.
This thermal budget must not induce any surface deformation incompatible with direct bonding.
Method like that described above advantageously uses a reduced thermal budget.
Remember that the thermal budget concept encompasses both the temperature of a treatment and its duration.
The formation of unbending areas is controlled by the thermal budget applied to structures.
The thermal budget is governed by the following differential equation,.
This step is performed so as to provide a large thermal budget for the surface atoms.
Controlling the thermal budget is referred to as " thermal management ".
This thermal annealing step poses a problem to the extent that it requires a significant thermal budget.
Consequently, the thermal budget is lower.

See also

Chemical mechanical polishing of copper ; no thermal budget.
Consequently, in this example the thermal budget is related to the hydrogen implantation dose.
Therefore, the limiting pressure depends on the thermal budget.
Therefore, CVD has a lower thermal budget and lower costs.
The challenge was to find the best processes with a back-end compatible thermal budget.
Moreover, the short pulse duration provides a low thermal budget which reduces the dopant diffusion.
Furthermore, InGaAs and SiGe require very different processing conditions in terms of thermal budget.
In this case, the increase in the thermal budget consolidates the structure 300.
But even as construction began, the team discovered that it had miscalculated the thermal budget.
This fracture operation will preferably be carried out under the thermal budget conditions described below.
Advantageously, the glue is hardened at a temperature lower than 150 ° C. compatible with a low thermal budget.
Also, high growth temperatures raise the thermal budget and costs.
These Ni-based electrodes are shown to be promising for a low thermal budget CMOS co-integration.
Point P 1 in FIG . 4B corresponds to one possible thermal budget for these steps.

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