Examples of 'solder alloy' in a sentence
Meaning of "solder alloy"
Solder alloy is a material made of a combination of metals used to join other metallic surfaces together through the process of soldering
How to use "solder alloy" in a sentence
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solder alloy
Solder alloy for plating and electronic component.
Bi reduces the melting point of the solder alloy.
Avoiding the use of lead in solder alloy is thus noticeable practice.
The solder alloy in a powdered shape is preferably contained in the solder paste.
Those elements are frequently added to a solder alloy in order to enhance heat cycle characteristics.
The physical and mechanical properties are also different for each solder alloy.
The solder alloy may contain unavoidable impurities in addition to the elements described above.
Soldering must be performed at a temperature above the liquidus temperature of the solder alloy.
The words eutectic solder describe a solder alloy that melts and freezes at one single temperature.
A solder alloy substantially consisting of,.
PbSn is the oldest solder alloy.
The balance of the solder alloy in the present invention is Sn.
Therefore, improvement in shock resistance after soldering is required for the solder alloy.
The addition of In to a solder alloy has the effect of improving heat cycle properties.
The present invention relates to the composition of a novel lead-free solder alloy.
See also
Molten solder alloy behaves much as water, with properties of cohesion and adhesion.
Therefore, the heat resistance of the solder alloy is deteriorated.
Then, a lead-free solder alloy is introduced that exhibits superior performance for demanding applications.
One type of interconnection called hard or semi-permanent, uses a low melting solder alloy.
According to the invention, the solder alloy components are defined for the following reasons,.
Alignment method according to the claim 9, wherein the fastening means comprise a metal solder alloy.
It belongs to soft solder alloy which is opposed to the high-melting-point hard solder alloy.
All examples exhibited strength values lower than that of the conventional tin-lead eutectic solder alloy.
A, Deformation of the solder alloy was not confirmed.
Co promotes the carbonization of the rosin, when Co is added to a Zr-free solder alloy.
Figure 1 is a DSC curve of the solder alloy of this example.
Lead-free solder alloy for use in terminal preplating, and electronic component.
Figure 5 is a DSC curve for the solder alloy of this examples.
In this case, the solder alloy can be used as a pellet - or disk-shaped solder preform.
However, Bi is naturally a brittle element and the Sn-Bi solder alloy is also brittle.
This lead-free solder alloy layer has the above-described chemical composition.
With reduction of interconnect dimension, the diameter of Cu / Ni pillar and solder alloy also reduces.
Balance, Sn The balance of the solder alloy in the present invention is Sn.
Introduction to lead-free Carbon Solder alloy.
Thus, the solder alloy is preferably contained in the solder paste ( solder paste connecting material ).
A solder paste comprising a solder powder composed of the solder alloy according to Claim 1, and flux.
However, this solder alloy contains Fe in a considerably large amount of 1 % or more.
Our Tech Support Engineers are well-versed in solder alloy selection.
A solder alloy of a tin-silver-copper solder alloy consisting of,.
It is capable of taking in the air ( vacuum pickup ) and solder alloy.
A solder alloy of a tin-silver-copper solder alloy comprising:.
A solder paste comprising the high-temperature lead-free solder alloy according to claim 1.
The obtained solder alloy was powdered so that the particle size thereof was 25 to 38 µm.
A solder preform comprising the high-temperature lead-free solder alloy according to claim 1.
In other words, the solder alloy substantially consists of tin, silver, indium, bismuth, and antimony.
Some of the advantages of a lead-free, low temperature, binary solder alloy should embody include,.
A solder alloy for the hot-dip solder plating layers 3 A, 3 B will be described below.
A solder joint formed using the high-temperature lead-free solder alloy according to claim 1.
The present invention relates to an Sn-Sb-Ag-Cu based, high-temperature lead-free solder alloy.
A solder preform comprising the high-temperature lead-free solder alloy according to any one of claims 1 to 5.
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