Examples of 'thickness of the substrate' in a sentence
Meaning of "thickness of the substrate"
thickness of the substrate: This term refers to the measure of the distance between the top and bottom surfaces of the material on which a process is being performed or which an object is placed
How to use "thickness of the substrate" in a sentence
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thickness of the substrate
The thickness of the substrate is not limited.
The invention is not limited by the thickness of the substrate.
The thickness of the substrate can vary as desired.
The depth of the channels is typically related to the thickness of the substrate.
Even when the thickness of the substrate is increased.
The thickness obtained is in general slightly greater than the thickness of the substrate.
The thickness of the substrate is chosen according to the plants.
This is due to the high tolerance and very low thickness of the substrate.
Increasing the thickness of the substrate widens the resonant frequency bands.
The depth thereof means the dimension thereof into the thickness of the substrate.
The thickness of the substrate is not critical and may vary largely.
We first have to consider the thickness of the substrate and the peritoneal coating.
The thickness of the substrate corresponds to its dimension measured perpendicular to the transfer surface.
The resin thus present extends over the entire thickness of the substrate paper.
The overall thickness of the substrate can be varied depending on the final use.
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These suspension strips have for thickness the thickness of the substrate and are extremely narrow.
The thickness of the substrate 2 is not particularly limited.
The structurally weakened área includes a thickness that is substantially less than a thickness of the substrate.
Therefore, the thickness of the substrate should be as thin as possible.
The surface layer has a thickness which is less than the thickness of the substrate layer.
Determining the thickness of the substrate on which the header connector is to be mounted ;.
However, this value also depends on the overall thickness of the substrate.
The thickness of the substrate 8 is limited by the dimensions of the radio communication apparatus.
Depending on the application, the thickness of the substrate can vary widely.
This face is advantageously flat, along a plane advantageously perpendicular to the thickness of the substrate.
An operation for reducing the thickness of the substrate 2 could also be carried out.
A rectangular section is possible for the trenches, depending on the thickness of the substrate.
In general, the thickness of the substrate 3 may range from a few micrometres to a few nanometres.
However, the current should then cross the entire thickness of the substrate.
However, the thickness of the substrate plays an essential mechanical role when manufacturing integrated circuits.
Using a single row of microshutters, the thickness of the substrate could be a few millimetres.
The thickness of the substrate is in the range of preferably about 2 to 20 µm.
The next step of the process consists of reducing the thickness of the substrate 1.
Progressively thinning a thickness of the substrate towards the inner layer including the porous zone ;.
In general terms, height means a dimension situated along the thickness of the substrate.
Likewise, the thickness of the substrate SUBSI remains constant, whatever the number n may be.
The thickness of the USB connector depends mainly on the thickness of the substrate 13.
The total thickness of the substrate is 75 mm.
It is more particularly less than 35 % of the thickness of the substrate.
The thickness of the substrate is preferably 3 mm or less, more preferably, 2 mm or less.
The pickup position is determined by the thickness of the substrate 114 being engaged.
The initial thickness of the substrate was 3.2 mm prior to consolidating one surface.
The microchannels 16 thus pass through the whole thickness of the substrate 15.
The thickness of the substrate 210 is in the order of a few hundred microns.
To provide this support function, the thickness of the substrate is preferably greater than 10 um.
The thickness of the substrate 1 is in the range from 1 to 5 mm.
The method of claim 1, wherein the thickness of the substrate is between 1 and 3 um.
The thickness of the substrate layer of silicon 40 is greater than 80 um.
A height " B " of the insertion concave part 41 is slightly greater than the thickness of the substrate 33.
The thickness of the substrate is for example between 500 um and 2 mm.
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